The AnandTech Podcast, Episode 36: Mobile World Congress 2016, Snapdragon 820 and Exynos 8890
by Ian Cutress on February 29, 2016 7:00 AM EST
AnandTech Podcast #36: The annual smartphone extravaganza known as Mobile World Congress has come and gone. We clocked up 45.4km on foot during the week, averaging around five hours sleep and one meal a day to be able to see everyone of interest. Because so many interesting things were presented, from LG, Samsung, Huawei, Xiaomi and others, just before we left Barcelona Andrei and I put together a podcast of details, experience and analysis of the new devices. There are plenty of talking points with each of them, from a modular design to heatpipes to new silicon microarchitectures, and we recorded our initial impressions in a podcast.
The AnandTech Podcast - Episode 36
Featuring
- Dr Ian Cutress, Host, Senior Editor (@IanCutress)
- Andrei Frumuşanu, Mobile Editor (@andreif7)
iTunes
RSS - mp3, m4a
Direct Links - mp3, m4a
Total Time: 1 hour 04 minutes 34 seconds
Outline mm:ss
00:00 – Intro
00:38 – LG G5
08:04 – Samsung Galaxy S7/S7 Edge
15:35 – Some thoughts about heatpipes on smartphones
17:27 – Details on 8890, thoughts on turbo mode on SoCs
22:40 – Waterproofing on S7/S7e
26:13 – Camera on S7/S7e
28:43 – Xiaomi Mi 5
42:32 – There’s a low bin of the Snapdragon 820
44:25 – HTC Vive Pricing
48:21 – Cat S60
52:23 – LG VR
58:49 – Huawei Matebook
1:04:24 – FIN
Related Reading
LG G5 Launch
Exynos 8890 (Samsung Galaxy S7) Initial Test and Thoughts
Hands On with the Samsung Galaxy S7 and S7 edge
Xiaomi Mi 5 Pro Hands on and Snapdragon 820 Initial Test
HTC Vive Announces Pricing: $799 For The Kit
Cat S60: Rugged Smartphone with Integrated Thermal Camera
Huawei Matebook Launched
MWC 2016 Live Blogs
LG G5 Live Blog
Huawei Live Blog
Samsung Live Blog
Sony Live Blog
Gionee Live Blog
Xiaomi Live Blog
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lilmoe - Tuesday, March 1, 2016 - link
All performance SoC will run hot. Anandtech are being extremely stubborn on how efficiency is measured. It's NOT about max clocks, it's about common workloads, which "benchmarks" aren't. Both chips will be more power efficient than their last iterations, and you should have nothing to worry about.The heat pipes Samsung are using should improve heat dissipation, and increase power efficiency as a result. There is an extremely important factor that's being ignored here: For the SAME chip, a cooler implementation runs more efficiently than a hot one under the same workload, and draws less power.
I've already preordered mine and will be testing it extensively on my own.
andrewia - Tuesday, March 1, 2016 - link
Correction: Sony has used heatpipes since the Z2 (which introduced the Snapdragon 801). The Z4 has severe throttling issues since it uses the Snapdragon 810. The Z5 added a second heatpipe to deal with the 810.hans_ober - Tuesday, March 1, 2016 - link
I think Sony had a heatpipe in the Z2/Z3.. before S810.