TSMC to Receive $6.6B Under US CHIPS Act, Set to Build 2nm Fab in Arizona
TSMC has entered into a preliminary agreement with the U.S. Department of Commerce, securing up to $6.6 billion in direct funding and access to up to $5 billion in...
23 by Anton Shilov on 4/8/2024
SK hynix to Build $3.87 Billion Memory Packaging Fab in the U.S. for HBM4 and Beyond
SK hynix this week announced plans to build its advanced memory packaging facility in West Lafayette, Indiana. The move can be considered as a milestone both for the memory...
7 by Anton Shilov on 4/5/2024
PCIe 7.0 Draft 0.5 Spec Available: 512 GB/s over PCIe x16 On Track For 2025
PCI-SIG this week released version 0.5 of the PCI-Express 7.0 specification to its members. This is the second draft of the spec and the final call for PCI-SIG members...
17 by Anton Shilov on 4/4/2024
Samsung Unveils CXL Memory Module Box: Up to 16 TB at 60 GB/s
Composable disaggregated data center infrastructure promises to change the way data centers for modern workloads are built. However, to fully realize the potential of new technologies, such as CXL...
17 by Anton Shilov on 4/3/2024
Rapidus to Get $3.9 Billion in Government Aid for 2nm, Multi-Chiplet Technologies
Rapidus, a Japan-based company developing 2nm process technology and aiming to commercialize it in 2027, will receive a huge government grant for its ongoing projects. The Japanese government will...
10 by Anton Shilov on 4/2/2024
Introspect Intros GDDR7 Test System For Fast GDDR7 GPU Design Bring Up
Introspect this week introduced its M5512 GDDR7 memory test system, which is designed for testing GDDR7 memory controllers, physical interface, and GDDR7 SGRAM chips. The tool will enable memory...
0 by Anton Shilov on 3/29/2024
Western Digital Ships 24TB Red Pro Hard Drive For NASes [UPDATED]
Nowadays highest-capacity hard drives are typically aimed at cloud service providers (CSPs) and enterprises, but this does not mean that creative professionals or regular users do not need them...
18 by Anton Shilov on 3/28/2024
HBM Revenue Poised To Cross $10B as SK hynix Predicts First Double-Digit Revenue Share
Offering some rare insight into the scale of HBM memory sales – and on its growth in the face of unprecedented demand from AI accelerator vendors – the company...
6 by Anton Shilov on 3/28/2024
GDDR7 Approaches: Samsung Lists GDDR7 Memory Chips on Its Product Catalog
Now that JEDEC has published specification of GDDR7 memory, memory manufacturers are beginning to announce their initial products. The first out of the gate for this generation is Samsung...
18 by Anton Shilov on 3/27/2024
Report: SK Hynix Mulls Building $4 Billion Advanced Packaging Facility in Indiana
SK hynix is considering whether to build an advanced packaging facility in Indiana, reports the Wall Street Journal. If the company proceeds with the plan, it intends to invest...
4 by Anton Shilov on 3/26/2024
Intel Announces Expansion to AI PC Dev Program, Aims to Reach More Software & Hardware Devs
Today, Intel announced that it is looking to progress its AI PC Acceleration program further by offering various new toolkits and devkits designed for software and hardware AI developers...
8 by Gavin Bonshor on 3/26/2024
Report: China to Pivot from AMD & Intel CPUs To Domestic Chips in Government PCs
China has initiated a policy shift to eliminate American processors from government computers and servers, reports Financial Times. The decision is aimed to gradually eliminate processors from AMD and...
12 by Anton Shilov on 3/26/2024
Construction of $106B SK hynix Mega Fab Site Moving Along, But At Slower Pace
When a major industry slowdown occurs, big companies tend to slowdown their mid-term and long-term capacity related investments. This is exactly what happened to SK hynix's Yongin Semiconductor Cluster...
8 by Anton Shilov on 3/23/2024
Micron Samples 256 GB DDR5-8800 MCR DIMMs: Massive Modules for Massive Servers
Micron this week announced that it had begun sampling of its 256 GB multiplexer combined (MCR) DIMMs, the company's highest-capacity memory modules to date. These brand-new DDR5-based MCRDIMMs are...
4 by Anton Shilov on 3/22/2024
Micron Sells Out Entire HBM3E Supply for 2024, Most of 2025
Being the first company to ship HBM3E memory has its perks for Micron, as the company has revealed that is has managed to sell out the entire supply of...
27 by Anton Shilov on 3/22/2024
NVIDIA's GPU IP Drives into MediaTek's Dimension Auto SoCs
MediaTek this week has introduced a new lineup of Dimensity Auto Cockpit system-on-chips, covering the entire market spectrum from entry-level to premium. And while automotive chip announcements are admittedly...
6 by Anton Shilov on 3/21/2024
AMD Announces FSR 3.1: Seriously Improved Upscaling Quality
AMD's FidelityFX Super Resolution 3 technology package introduced a plethora of enhancements to the FSR technology on Radeon RX 6000 and 7000-series graphics cards last September. But perfection has...
21 by Anton Shilov on 3/21/2024
Ultra Ethernet Consortium Grows to 55 Members, Reveals Some Details on Upcoming HPC Backbone Tech
The Ultra Ethernet Consortium (UEC) has announced this week that the next-generation interconnection consortium has grown to 55 members. And as the group works towards developing the initial version...
8 by Anton Shilov on 3/21/2024
Qualcomm Intros Snapdragon 7+ Gen 3: Pushing GenAI Into Premium Smartphones
Proving the adage “ask, and you shall receive”, Qualcomm is back this week for a second Snapdragon SoC announcement for mobile phones. This time, the company is announcing the...
9 by Ryan Smith on 3/21/2024
Intel to Receive $8.5B in CHIPS Act Funding & Further Loans To Build US Fabs
Intel and the United States Department of Commerce announced on Wednesday that they had inked a preliminary agreement under which Intel will receive $8.5 billion in direct funding under...
20 by Anton Shilov on 3/20/2024
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