Memory
Of the several major changes coming with HBM4 memory, one of the most immediate is the sheer width of the memory interface. With the fourth-generation memory standard moving from an already wide 1024-bit interface to a ultra-wide 2048-bit interface, HBM4 memory stacks won't be business as usual; chip manufacturers are going to need to adopt more advanced packaging methods than are used today to accommodate the wider memory. As part of its European Technology Symposium 2024 presentation, TSMC offered some fresh details into the base dies it will be manufacturing for HBM4, which will be built using logic processes. With TSMC planning to employ variations of their N12 and N5 processes for this task, the company is expecting to occupy a favorable place in the...
Memory Makers on Track to Double HBM Output in 2023
TrendForce projects a remarkable 105% increase in annual bit shipments of high-bandwidth memory (HBM) this year. This boost comes in response to soaring demands from AI and high-performance computing...
9 by Anton Shilov on 8/9/2023
SK Hynix Shows Off 321-Layer 3D TLC NAND Device
SK Hynix showcased its 321-layer TLC NAND memory at the Flash Memory Summit 2023. The South Korean company is the first NAND maker to publicly demonstrate 3D NAND with...
11 by Anton Shilov on 8/9/2023
Micron's CZ120 CXL Memory Expansion Modules Unveiled: 128GB and 256GB
This week, Micron announced the sample availability of its first CXL 2.0 memory expansion modules for servers that promise easy and cheap DRAM subsystem expansions. Modern server platforms from...
7 by Anton Shilov on 8/9/2023
TeamGroup Unveils JEDEC-Spec DDR5-6400 Memory Kits: Faster 1.1V DDR5 On The Way For Future CPUs
While DDR5 memory has been out and in use for a couple of years now, so far we haven't seen the memory reach its full potential – at least...
5 by Anton Shilov on 7/31/2023
Samsung Begins to Produce Third 3nm Chip Amid Massive Losses On DRAM & NAND
Samsung this week reported their financial results for the second quarter of 2023, closing the book on an especially bleak quarter of the year with a massive $3.4 billion...
14 by Anton Shilov on 7/28/2023
Micron Publishes Updated DRAM Roadmap: 32 Gb DDR5 DRAMs, GDDR7, HBMNext
In addition to unveiling its first HBM3 memory products yesterday, Micron also published a fresh DRAM roadmap for its AI customers for the coming years. Being one of the...
4 by Anton Shilov on 7/27/2023
Micron Unveils HBM3 Gen2 Memory: 1.2 TB/sec Memory Stacks For HPC and AI Processors
Micron today is introducing its first HBM3 memory products, becoming the latest of the major memory manufacturers to start building the high bandwidth memory that's widely used in server-grade...
7 by Anton Shilov on 7/26/2023
Cadence Buys Memory and SerDes PHY Assets from Rambus
In a surprising turn of events, Cadence and Rambus entered into a definitive agreement late last week for Cadence to buy memory physical interface IP and SerDes businesses from...
5 by Anton Shilov on 7/24/2023
Samsung Completes Initial GDDR7 Development: First Parts to Reach Up to 32Gbps/pin
Samsung has announced this evening that they have completed development on their first generation of GDDR7 memory. The next iteration of the high bandwidth memory technology, which has been...
11 by Ryan Smith on 7/18/2023
Micron Expects to Debut GDDR7 Memory in 2024
Micron late on Wednesday revealed plans to introduce its first GDDR7 memory devices in the first half of 2024. The memory is expected to be used by next generation...
12 by Anton Shilov on 6/29/2023
G.Skill's 24GB DDR5-6000 Modules with AMD EXPO Profiles Released
G.Skill has quietly started selling its 24 GB DDR5 memory modules with AMD EXPO profiles for single-click overclocking. G.Skill's Trident Z5 Neo RGB modules are among the first EXPO-profiled...
4 by Anton Shilov on 6/28/2023
SK Hynix Starts Production of 238-Layer 3D NAND: 34% Denser with 2.4 GT/s Interface
SK Hynix announced this week that it had started volume production of its 238-layer TLC NAND memory. The new device promises higher bit density and lower NAND bits cost...
5 by Anton Shilov on 6/8/2023
TeamGroup Announces T-Force Xtreem ARGB DDR5 Memory: Up to DDR5-8266
At Computex 2023, TeamGroup unveiled two additions to its extensive family of memory products. Available with ARGB heatsinks or subtle black non-RGB heatsinks, the TeamGroup T-Force Xtreem DDR5 memory...
5 by Gavin Bonshor on 6/2/2023
Next-Generation CAMM, MR-DIMM Memory Modules Show Up at Computex
Dynamic random access memory is an indispensable part of all computers, and requirements for DRAM — such as performance, power, density, and physical implementation — tend to change now...
4 by Anton Shilov on 6/2/2023
Corsair Unveils Dominator Titanium DDR5 Kits: Reaching For DDR5-8000
Corsair has introduced its new Dominator Titanium series of DDR5 memory modules that will combine performance, capacity, and style. The new lineup of memory modules and kits will offer...
5 by Anton Shilov on 5/30/2023
SK Hynix Publishes First Info on HBM3E Memory: Ultra-wide HPC Memory to Reach 8 GT/s
SK Hynix was one of the key developers of the original HBM memory back in 2014, and the company certainly hopes to stay ahead of the industry with this...
5 by Anton Shilov on 5/30/2023
Micron Expects Impact as China Bans Its Products from 'Critical' Industries
In the latest move in the tit-for-tat technology trade war between the United States and China, on Sunday the Cyberspace Administration of China announced that it was effectively banning...
12 by Anton Shilov on 5/23/2023
Micron to Bring EUV to Japan: 1γ Process DRAM to Be Made in Hiroshima in 2025
Micron this week officially said that it would equip its fab in Hiroshima, Japan, to produce DRAM chips on its 1γ (1-gamma) process technology, its first node to use...
10 by Anton Shilov on 5/19/2023
Samsung Kicks Off DDR5 DRAM Production on 12nm Process Tech, DDR5-7200 in the Works
Samsung on Thursday said it had started high volume production DRAM chips on its latest 12nm fabrication process. The new manufacturing node has allowed Samsung to reduce the power...
18 by Anton Shilov on 5/18/2023
Report: DDR5 RDIMM Production Impacted by PMIC Compatibility Issues
Memory module producers have been shipping unbuffered DDR5 memory modules for desktop and laptop computers running Intel's 12th Generation Core 'Alder Lake' processors in high volumes since September, 2021...
4 by Anton Shilov on 4/26/2023
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