Memory
Of the several major changes coming with HBM4 memory, one of the most immediate is the sheer width of the memory interface. With the fourth-generation memory standard moving from an already wide 1024-bit interface to a ultra-wide 2048-bit interface, HBM4 memory stacks won't be business as usual; chip manufacturers are going to need to adopt more advanced packaging methods than are used today to accommodate the wider memory. As part of its European Technology Symposium 2024 presentation, TSMC offered some fresh details into the base dies it will be manufacturing for HBM4, which will be built using logic processes. With TSMC planning to employ variations of their N12 and N5 processes for this task, the company is expecting to occupy a favorable place in the...
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GeIL Unveils Orion Series Memory, Up to DDR4-4000 with 32 GB Memory Modules
GeIL has announced its newest family of DDR4 modules, the Orion series. Available in two versions, one standard and one for AMD platforms, the Orion series offers SKUs ranging...
7 by Gavin Bonshor on 6/11/2020
Patriot's New 32GB Modules Available: UDIMM up to DDR4-3600, SODIMM up to DDR4-3000
Patriot has released a new series of DDR4 32GB memory modules in its VIPER GAMING STEEL series, complementing the 32GB offerings of the Blackout series as well as for...
11 by Andrei Frumusanu on 6/9/2020
New ZADAK Twist DDR4 Memory, Up to DDR4-4133 and 256 GB
ZADAK has announced its latest range of DDR4 memory, the Twist series. Designed for users looking for a lower profile alternative to its previous memory brands, the Twist features...
7 by Gavin Bonshor on 5/6/2020
GeiL Unveils 64 GB DDR4-3200 SO-DIMM Kit, 2 x 32 GB
Memory manufacturer Golden Emporer International Limited, or known generally as GeiL, has announced its new memory line with support for Intel 10th Gen and AMD Ryzen 4000 series processors...
21 by Gavin Bonshor on 5/5/2020
XPG Spectrix D50 Memory: A More Subtle RGB DDR4
ADATA's XPG division has unveiled its latest addition in the high-performance DRAM segment, the Spectrix D50. Starting from 8 GB DDR4-3000 modules, the latest Spectrix D50 kits will go...
22 by Gavin Bonshor on 4/15/2020
ADATA's New 32 GB DDR4-3200 SO-DIMM, Ideal for Ryzen Mobile
ADATA, one of the leading manufacturers of DRAM and NAND products, has just unveiled its latest memory modules. The new ADATA DDR4-3200 32 GB parts are available in both...
41 by Gavin Bonshor on 4/15/2020
China Develops High Capacity QLC 3D NAND: YMTC at 1.33 Tb
Yangtze Memory Technologies Co. (YMTC) has announced that it's developed its new 128-layer 1.33 Tb QLC 3D NAND memory chip, the X2-6070. The new chip is based on its...
64 by Gavin Bonshor on 4/13/2020
SK Hynix: We're Planning for DDR5-8400 at 1.1 Volts
Back in November last year, we reported that SK Hynix had developed and deployed its first DDR5 DRAM. Fast forward to the present, and we also know SK Hynix...
86 by Gavin Bonshor on 4/3/2020
Micron to Start Volume Production of 128-Layer 3D NAND with RG Architecture This Quarter
As part of the company's second quarter financial earnings call, Micron has revealed that it is about to start volume production of its 4th Generation 3D NAND memory devices...
10 by Anton Shilov on 4/1/2020
Cadence DDR5 Update: Launching at 4800 MT/s, Over 12 DDR5 SoCs in Development
JEDEC still has not published the DDR5 specification officially, yet it looks like DRAM makers and SoC designers are preparing for the DDR5 launch at full steam. Cadence, which...
20 by Anton Shilov on 3/27/2020
TeamGroup Announces 32GB T-Force Vulcan Z and Dark Z DDR4 Modules
One of the world's largest DRAM memory manufacturers TeamGroup has unveiled its first DDR4 memory kits featuring 32 GB sticks under its gaming-focused T-Force brand. The T-Force Vulcan Z...
7 by Gavin Bonshor on 3/27/2020
Samsung to Produce DDR5 in 2021 (with EUV)
Samsung is on track to start volume production of DDR5 and LPDDR5 memory next year using a manufacturing technology that will take advantage of extreme ultraviolet lithography (EUVL). In...
20 by Anton Shilov on 3/25/2020
GlobalFoundries & Everspin Extend MRAM Pact to 12nm
GlobalFoundries and Everspin have announced that the two have extended their Spin-transfer Torque (STT-MRAM) joint development agreement (JDA) to 12LP (12 nm FinFET) platform. The extension will enable GlobalFoundries...
4 by Anton Shilov on 3/13/2020
Rambus Develops HBM2E Controller & PHY: 3.2 Gbps, 1024-Bit Bus
The latest enhancements to the HBM2 standard will clearly be appreciated by developers of memory bandwidth-hungry ASICs, however in order to add support of HBM2E to their designs, they...
42 by Anton Shilov on 3/6/2020
ATP’s DDR4-3200 Industrial DIMMs: Up to 128GB @ 1.2V for AMD & Intel
ATP has unveiled its latest memory modules for servers and industrial applications, boasting a 3200 MT/s data transfer rate, an industry-standard voltage, and capacities ranging from 2 GB to...
7 by Anton Shilov on 3/5/2020
Samsung Starts Production of 16 GB LPDDR5-5500 for Smartphones
Samsung has begun mass production of the industry’s first 16 GB LPDDR5 memory for upcoming smartphones, such as the Galaxy S20 Ultra 5G handsets. The new DRAM devices not...
33 by Anton Shilov on 2/25/2020
SMART Modular Reveals 32 GB DDR4-3200 Low Profile Mini-DIMMs for Extreme Environments
SMART Modular has unveiled a new lineup of 32 GB Mini-DIMMs for extreme environments, such as industrial or telecommunication applications. The new high-density modules come in ULP (Ultra Low...
7 by Anton Shilov on 2/14/2020
G.Skill Launches 256 GB DDR4-3600 CL16 Memory Kit
The arrival of 32 GB unbuffered DIMMs has not only allowed mainstream systems to reach 128 GB of memory, but it's also allowed high-end desktops based on AMD Ryzen...
8 by Anton Shilov on 2/12/2020
SK Hynix Licenses DBI Ultra Interconnect for Next-Gen 3DS and HBM DRAM
SK Hynix has inked a new broad patent and technology licensing agreement with Xperi Corp. Among other things, the company licensed the DBI Ultra 2.5D/3D interconnect technology developed by...
9 by Anton Shilov on 2/11/2020
GIGABYTE Launches Designare DDR4-3200 Memory, a 64 GB Kit
GIGABYTE is a relatively new player on the memory market, yet it clearly wants to participate in the premier league. As seen at CES, this week the company introduced...
23 by Anton Shilov on 2/6/2020
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