Comments for TSMC's System-on-Wafer Platform Goes 3D: CoW-SoW Stacks Up the Chips

TSMC's System-on-Wafer Platform Goes 3D: CoW-SoW Stacks Up the Chips

by Anton Shilov on 4/26/2024 8:00 AM EST

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Tesla
Semiconductors
Packaging
Cerebras
CoWoS
3D Packaging
InFO
TSMC Symposium 2024
InFO_SoW
SoW

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Dante Verizon - Friday, April 26, 2024 - link
Sufficient for communication between GPU dies? Reply
skaurus - Saturday, April 27, 2024 - link
That wafer could be one GPU die in itself if you want. Reply

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TSMC's System-on-Wafer Platform Goes 3D: CoW-SoW Stacks Up the Chips

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2 Comments

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Dante Verizon - Friday, April 26, 2024 - link

skaurus - Saturday, April 27, 2024 - link

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