Not Dead Yet: WD Releases New 6TB 2.5-Inch External Hard Drives - First Upgrade in Seven Years
The vast majority of laptops nowadays use solid-state drives, which is why the development of new, higher-capacity 2.5-inch hard drives has all but come to a halt. Or rather...
3 by 3 hours ago
TSMC to Expand Specialty Capacity by 50%, Introduce 4nm N4e Low-Power Node
With all the new fabs being built in Germany and Japan, as well as the expansion of production capacity in China, TSMC is planning to extend its production capacity...
0 by 5 hours ago
TSMC Readies Next-Gen HBM4 Base Dies, Built on 12nm and 5nm Nodes
Of the several major changes coming with HBM4 memory, one of the most immediate is the sheer width of the memory interface. With the fourth-generation memory standard moving from...
1 by 14 hours ago
TSMC: Performance-Optimized 3nm N3P Process on Track for Mass Production This Year
As part of the second leg of TSMC's spring technology symposium series, the company offered an update on the state of its 3nm-class processes, both current and future. Building...
14 by yesterday
AMD Hits Record High Share in x86 Desktops and Servers in Q1 2024
Coming out of the dark times that preceded the launch of AMD's Zen CPU architecture in 2017, to say that AMD has turned things around on the back of...
44 by 6 days ago
Sabrent Launches Rocket Nano M.2-2242 SSD: Up to 5 GB/sec
Sabrent tends to get into news when it launches ultra-high-performance SSDs for enthusiast-grade desktops, but this week the company introduced a completely different type of product: a small form-factor...
4 by on 5/9/2024
Micron Ships Crucial-Branded LPCAMM2 Memory Modules: 64GB of LPDDR5X For $330
As LPCAMM2 adoption begins, the first retail memory modules are finally starting to hit the retail market, courtesy of Micron. The memory manufacturer has begun selling their LPDDR5X-based LPCAMM2...
13 by on 5/8/2024
ASUS to Unveil First Qualcomm Snapdragon X Elite-Based Laptop On May 20th
Asus on Tuesday said that it would announce its first 'AI PC' based on Qualcomm's Snapdragon X Elite system-on-chips later this month. The new laptop is set to be...
7 by on 5/7/2024
Samsung Tapes Out Its First 3nm Smartphone SoC, Gets A Boost From Synopsys AI-Enabled Tools
This week Samsung Electronics and Synopsys announced that Samsung has taped out its first mobile system-on-chip on Samsung Foundry's 3nm gate-all-around (GAA) process technology. The announcement, coming from electronic...
8 by on 5/3/2024
SK hynix Reports That 2025 HBM Memory Supply Has Nearly Sold Out
Demand for high-performance processors for AI training is skyrocketing, and consequently so is the demand for the components that go into these processors. So much so that SK hynix...
6 by on 5/2/2024
AMD Zen 5 Status Report: EPYC "Turin" Is Sampling, Silicon Looking Great
As part of AMD's Q1'2024 earnings announcement this week, the company is offering a brief status update on some of their future products set to launch later this year...
41 by on 5/1/2024
Samsung Foundry Update: 2nm Unveil in June, Second-Gen SF3 3nm Hits Production This Year
As part of Samsung's Q1 earnings announcement, the company has outlined some of its foundry unit's key plans for the rest of the year. The company has confirmed that...
4 by on 5/1/2024
TSMC Readies 8x Reticle Super Carrier Interposer For Next-Gen Chips Twice as Large As Today's
TSMC is no stranger to building big chips. Besides the ~800mm2 reticle limit of their normal logic processes, the company already produces even larger chips by fitting multiple dies...
6 by on 4/30/2024
TSMC Jumps Into Silicon Photonics, Lays Out Roadmap For 12.8 Tbps COUPE On-Package Interconnect
Optical connectivity – and especially silicon photonics – is expected to become a crucial technology to enable connectivity for next-generation datacenters, particularly those designed HPC applications. With ever-increasing bandwidth...
9 by on 4/26/2024
TSMC's System-on-Wafer Platform Goes 3D: CoW-SoW Stacks Up the Chips
TSMC has been offering its System-on-Wafer integration technology, InFO-SoW, since 2020. For now, only Cerebras and Tesla have developed wafer scale processor designs using it, as while they have...
2 by on 4/26/2024
TSMC Preps Cheaper 4nm N4C Process For 2025, Aiming For 8.5% Cost Reduction
While the bulk of attention on TSMC is aimed at its leading-edge nodes, such as N3E and N2, loads of chips will continue to be made using more mature...
5 by on 4/25/2024
TSMC 2nm Update: N2 In 2025, N2P Loses Backside Power, and NanoFlex Brings Optimal Cells
Taiwan Semiconductor Manufacturing Co. provided several important updates about its upcoming process technologies at its North American Technology Symposium 2024. At a high level, TSMC's 2 nm plans remain...
0 by on 4/25/2024
TSMC's 1.6nm Technology Announced for Late 2026: A16 with "Super Power Rail" Backside Power
With the arrival of spring comes showers, flowers, and in the technology industry, TSMC's annual technology symposium series. With customers spread all around the world, the Taiwanese pure play...
18 by on 4/25/2024
Report: Seagate, Western Digital Hike HDD Prices Amid Surge In Demand
Seagate Technology has reportedly notified its customers abouts its plans to raise prices on new hard drive orders and for demands that exceed prior agreements, echoing a similar move...
11 by on 4/24/2024
Seagate: Mozaic 3+ HAMR Hard Drives Can Last Over Seven Years
As Seagate ramps up shipments of its new heat assisted magnetic recording (HAMR)-based Mozaic 3+ hard drive platform, the company is both in the enviable position of shipping the...
13 by on 4/23/2024
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